MIC substrate integrated ceramic package
MIC substrate integrated ceramic package
We have developed a millimeter-wave and microwave package that combines an MIC substrate with a ceramic cap processed by microblasting.
- 企業:東洋精密工業
- 価格:Other
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MIC substrate integrated ceramic package
We have developed a millimeter-wave and microwave package that combines an MIC substrate with a ceramic cap processed by microblasting.